1.0 PC Hardware


1.6 Differentiate among various CPU types and features and select the appropriate cooling method.


  • Socket types

    Intel

    Name CPU Families Pkg Pin Count Bus Speed
    775
    Socket T
    Intel Pentium 4
    Intel Pentium D
    Intel Celeron
    Intel Celeron D
    Intel Pentium XE
    Intel Core 2 Duo
    Intel Core 2 Quad
    Intel Xeon
    LGA 775 MB 1600 MHz
    1155
    Socket H2
    Intel Sandy Bridge-DT LGA 1155 5 GT/s
    1156
    Socket H
    Intel Core i7 (800 series)
    Intel Core i5 (700, 600 series)
    Intel Core i3 (500 series)
    Intel Xeon (X3400, L3400 series)
    Intel Pentium (G6000 series)
    Intel Celeron (G1000 series)
    LGA 1156 2.5 GT/s
    1366
    Socket B
    Intel Core i7 (900 series)
    Intel Xeon (35xx, 36xx, 55xx, 56xx series)
    LGA 1366 4.8-6.4 GT/s

    AMD

    Name CPU Families Pkg Pin Count Bus Speed
    940 AMD Opteron Athlon 64 FX PGA 940 200–1000 MHz
    AM2 AMD Athlon 64
    AMD Athlon 64 X2
    PGA 940 200–1000 MHz
    AM2+ AMD Athlon 64
    AMD Athlon X2
    AMD Phenom
    AMD Phenom II
    PGA 940 200–2600 MHz
    AM3 AMD Phenom II
    AMD Athlon II
    AMD Sempron
    PGA 940 or 941 200–3200 MHz
    AM3+ AMD FX
    Bulldozer
    (microarchitecture)
    PGA 942
    938pin CPU
    FM1 AMD Llano Processor PGA 905
    F AMD Athlon 64 FX
    AMD Opteron
    LGA 1207


  • Characteristics
    • Speeds

    • Cores

    • Cache size/type

    • Hyperthreading

      Hyperthreading is an Intel proprietary technology that enables two streams of data to run simultaneously on each processor core. To utilize this technology, the operating system and BIOS must both be capable of supporting multiple processors.


    • Virtualization support

    • Architecture (32-bit vs. 64-bit)

    • Integrated GPU


  • Cooling
    • Heat sink

      Typically made from aluminum or copper, heat sinks are designed to transfer heat away from components through conduction.


    • Fans

      Provides air cooling, the most common method of cooling.


    • Thermal paste

      Designed to fill imperfections or gaps between the component and heat sink to promote heat transfer. Pre-existing compound should be cleaned and reapplied any time the heat sink is removed.


    • Liquid-based

      Newest and most efficient method of cooling.



Recommended

Exam Cram CompTIA A+ 220-801 Sixth Edition Study Guide   Mike Meyers All-In-One CompTIA A+ 220-801 Study Guide




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