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1.6 Differentiate among various CPU types and features and select the appropriate cooling method.
- Socket types
Intel
Name |
CPU Families |
Pkg |
Pin Count |
Bus Speed |
775
Socket T |
Intel Pentium 4
Intel Pentium D
Intel Celeron
Intel Celeron D
Intel Pentium XE
Intel Core 2 Duo
Intel Core 2 Quad
Intel Xeon |
LGA |
775 MB |
1600 MHz |
1155
Socket H2 |
Intel Sandy Bridge-DT |
LGA |
1155 |
5 GT/s |
1156
Socket H |
Intel Core i7 (800 series)
Intel Core i5 (700, 600 series)
Intel Core i3 (500 series)
Intel Xeon (X3400, L3400 series)
Intel Pentium (G6000 series)
Intel Celeron (G1000 series) |
LGA |
1156 |
2.5 GT/s |
1366
Socket B |
Intel Core i7 (900 series)
Intel Xeon (35xx, 36xx, 55xx, 56xx series) |
LGA |
1366 |
4.8-6.4 GT/s |
AMD
Name |
CPU Families |
Pkg |
Pin Count |
Bus Speed |
940 |
AMD Opteron Athlon 64 FX |
PGA |
940 |
200–1000 MHz |
AM2 |
AMD Athlon 64
AMD Athlon 64 X2 |
PGA |
940 |
200–1000 MHz |
AM2+ |
AMD Athlon 64
AMD Athlon X2
AMD Phenom
AMD Phenom II |
PGA |
940 |
200–2600 MHz |
AM3 |
AMD Phenom II
AMD Athlon II
AMD Sempron |
PGA |
940 or 941 |
200–3200 MHz |
AM3+ |
AMD FX
Bulldozer
(microarchitecture) |
PGA |
942
938pin CPU |
|
FM1 |
AMD Llano Processor |
PGA |
905 |
|
F |
AMD Athlon 64 FX
AMD Opteron |
LGA |
1207 |
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- Characteristics
- Cooling
- Heat sink
Typically made from aluminum or copper, heat sinks are designed to transfer heat away from components through conduction.
- Fans
Provides air cooling, the most common method of cooling.
- Thermal paste
Designed to fill imperfections or gaps between the component and heat sink to promote heat transfer. Pre-existing compound should be cleaned and reapplied any time the heat sink is removed.
- Liquid-based
Newest and most efficient method of cooling.
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