1.0 Hardware

1.5 Explain cooling methods and devices

  • Heat sinks

    Typically made from aluminum or copper, heat sinks are designed to transfer heat away from components through conduction.

  • CPU and case fans

    Provides air cooling, the most common method of cooling.

  • Liquid cooling systems

    Newest and most efficient method of cooling.

  • Thermal compound

    Designed to fill imperfections or gaps between the component and heat sink to promote heat transfer. Pre-existing compound should be cleaned and reapplied any time the heat sink is removed.